1;Advances in Electrochemical Science and Engineering;3 1.1;Contents;7 1.2;Series Preface;11 1.3;Volume Preface;13 1.4;List of Contributors;15 1.5;1 Valve Metal, Si and Ceramic Oxides as Dielectric Films for Passive and Active Electronic Devices;17 1.5.1;1.1 Introduction;17 1.5.1.1;1.1.1 Experimental Approaches;18 1.5.2;1.2 Fundamentals and Experimental Details;21 1.5.2.1;1.2.1 Electrochemical Oxide Layer Formation on Valve Metals;21 1.5.2.2;1.2.2 The C(U) Curve of a Valve Metal Electrode;23 1.5.2.3;1.2.3 Application of Lasers in Electrochemistry;24 1.5.2.3.1;1.2.3.1 Thermal Effects;25 1.5.2.4;1.2.4 Electrochemical Photocurrent Measurements (Optical/Electrical Method Class), Introduction of a New Model;26 1.5.2.4.1;1.2.4.1 Photocurrent Model for Ultra-thin, Amorphous Films With TiO(2) as an Example;27 1.5.3;1.3 Valve Metal Systems;31 1.5.3.1;1.3.1 Ti/TiO(2) System;31 1.5.3.1.1;1.3.1.1 Experimental Details;31 1.5.3.1.2;1.3.1.2 Determination of Ti Substrate Grain Orientation by SAME;33 1.5.3.1.3;1.3.1.3 Photocurrent Spectra and i(ph)(U) Measurements on Single Ti/TiO(2) Grains;34 1.5.3.1.4;1.3.1.4 Microscopic Modification of the TiO(2) Films by Means of Laser Scanning;35 1.5.3.1.5;1.3.1.5 Characterization of the Modified TiO(2) Films;37 1.5.3.1.6;1.3.1.6 Photoresist Microelectrochemistry (Nanoliter Droplet Method);41 1.5.3.1.7;1.3.1.7 Applications of Photoresist Microelectrodes;44 1.5.3.1.8;1.3.1.8 Summary and Conclusions for the Ti/TiO(2) System;52 1.5.3.2;1.3.2 Zr/ZrO(2) and Hf/HfO(2) Systems;53 1.5.3.2.1;1.3.2.1 Zr/ZrO(2);53 1.5.3.2.2;1.3.2.2 Hf/HfO(2);62 1.5.3.3;1.3.3 Systems: Nb/Nb(2)O(5), Ta/Ta(2)O(5) and Al/Al(2)O(3);64 1.5.3.3.1;1.3.3.1 Nb/Nb(2)O(5) System;65 1.5.3.3.2;1.3.3.2 Al/Al(2)O(3) System;69 1.5.3.3.3;1.3.3.3 Ta/Ta(2)O(5) System;70 1.5.3.4;1.3.4 Application of Valve Metals in Electrolytic Capacitor Manufacturing;73 1.5.3.4.1;1.3.4.1 Capacitor Fundamentals;73 1.5.3.4.2;1.3.4.2 Capacitor Device Types and Production of Ta Capacitors;78 1.5.3.4.3;1.3.4.3 Current Development Trends for Ta Capacitors and Research Issues Involved;81 1.5.3.4.4;1.3.4.4 Effect of Oxygen Content and Sinter Conditions on Dislocation Formation;83 1.5.3.4.5;1.3.4.5 Thermal Runaway;86 1.5.4;1.4 Si/SiO(2) System;90 1.5.4.1;1.4.1 Application of the Si/SiO(2) System;93 1.5.4.1.1;1.4.1.1 Si/SiO(2) in MOSFETs;93 1.5.4.1.2;1.4.1.2 Si/SiO(2) in DRAMs;96 1.5.4.1.3;1.4.1.3 DRAM Storage Capacitor (Deep Trench);98 1.5.4.2;1.4.2 Alternative Dielectric Materials;106 1.5.4.2.1;1.4.2.1 Ta(2)O(5);108 1.5.4.2.2;1.4.2.2 Ti/TiO(2);111 1.5.5;1.5 Summary and Conclusions;112 1.5.6;References;115 1.6;2 Superconformal Film Growth;123 1.6.1;2.1 Introduction;123 1.6.2;2.2 Destabilizing Influences;124 1.6.3;2.3 Stabilization and Smoothing Mechanisms;126 1.6.3.1;2.3.1 Geometric Leveling;126 1.6.3.2;2.3.2 Inhibitor-based Leveling;126 1.6.3.3;2.3.3 Brightening by Grain Refinement;127 1.6.3.4;2.3.4 Catalyst-derived Brightening;128 1.6.3.5;2.3.5 Stabilization Across Length Scales;128 1.6.4;2.4 Additive Processes;129 1.6.4.1;2.4.1 Adsorption Kinetics;133 1.6.4.2;2.4.2 Surface Segregation versus Consumption Processes;133 1.6.4.2.1;2.4.2.1 Adsorbates Segregated onto Growing Surface;134 1.6.4.2.2;2.4.2.2 Adsorbates Incorporated into Growing Deposit;135 1.6.4.2.3;2.4.2.3 Deactivation of Adsorbate;137 1.6.4.3;2.4.3 Adsorbate Evolution;137 1.6.4.4;2.4.4 Impact on Microstructure;138 1.6.4.5;2.4.5 Quantifying Adsorbate Inhibition of Metal Deposition;141 1.6.4.6;2.4.6 Co-adsorption Effects;146 1.6.4.7;2.4.7 Catalysis of Metal Deposition;150 1.6.4.8;2.4.8 Activation of Blocked Electrodes by Competitive Adsorption of a Catalyst;151 1.6.4.9;2.4.9 Catalyst Function and Consumption;154 1.6.4.10;2.4.10 Quantifying the Effects of Competitive Adsorption on Metal Deposition;157 1.6.4.10.1;2.4.10.1 Site Dependence of Charge Transfer Kinetics;158 1.6.4.10.2;2.4.10.2 Catalyst Evolution;159 1.6.4.10.3;2.4.10.3 SPS Adsorption from the Electrolyte;159 1.6.5;2.5 Interface Motion and Morphological Evolu